Come See Us at the ISTA Transport Packaging Forum

Lansmont is a platinum sponsor of the ISTA Transport Packaging Forum (April 2–5). This annual event is a great opportunity to stay in tune with current testing and research efforts and to network with our customers. Attending is an excellent opportunity to learn about some of the latest research being performed at universities and corporations to advance the field of transport package testing.

Removing Waste from the Packaged-Product Design.Many conference speakers will be discussing innovative methods for measuring and replicating transport conditions. One of the highlights this year will be Eric Joneson, Lansmont’s VP of Technology and the Immediate Past Chair of ISTA. Eric will explain how product fragility testing and field data measurement enable you to remove waste from your packaging system. Understanding a product’s fragility levels makes it easier to optimize the transport packaging design. Sustainability has been a hot topic amongst packaging professionals in recent years. Product fragility testing should be considered in any discussions of sustainable packaging.
Lansmont FTL user group exchange.Before the conference begins, Lansmont will host a User Group Exchange, promoting collaborative dialogue with our customers about new and innovative technologies we’ll be deploying across our Field-to-Lab product offerings. Lansmont’s President and Product Managers will be present to participate in our User Group Exchange and will be attending the Forum.

We welcome you to stop by during the Exhibitor Reception to learn more about the latest developments we’ve been working on with our Equipment and Instruments. See you in Orlando!